CL-2025 packaging information reference pattern layout dimension reference metal mask design packaging information / reference pattern layout dimensions unit: mm 1.10.05 0.20.05 2.00.1 0.20.05 1.04 max external lead
CL-2025 reel taping specifications taping specifications unit: mm 3000pcs/reel r type :[device orientation : right] standard feed direction of feed
CL-2025 power dissipation power dissipation data for the CL-2025 is shown in this page. the value of power dissipation varies with the mount board cond itions. please use this data as one of reference data taken in the desc ribed condition. 1. measurement condition (reference data) condition: mount on a board ambient: natural convection soldering: lead (pb) free board: dimensions 40 x 40 mm (1600 mm2 in one side) copper (cu) traces occupy 50% of the board area in top and back faces package heat-sink is tied to the copper traces material: glass epoxy (fr-4) thickness: 1.6 mm through-hole: 4 x 0.8 diameter 2. power dissipation vs. ambient temperature board mount (tj max = 125) evaluation board (unit: mm) 85 25 thermal resistance(/w) power dissipa tion pdmw ambient temperature 100.00 250 1000 pd vs ta 0 200 400 600 800 1000 1200 25 45 65 85 105 125 ambient temperatureta power dissipation pd mw
rohs ? rohs com p liance ? item material ? core ferrite ?` bt ? + ?? base substrate bt resin + epoxy resin go?? a ?? overcoating resin a epoxy resin o?? b ( ???`? ) overcoating resin b (top coating) ?? adhesive resin ( ) ~ conductor copper U?`??, ?? terminal lead(pb) free solder plating, nickel ?? adhesive resin epoxy resin ?? ? silicon chip silicon `??? ?? , lead-pad nickel, gold plating ? ? ? die attach epoxy ? ???? bonding wire au ? ?? ?? resin epoxy resin ?? `` marking laser marking ic CL-2025 CL-2025 perspective /coil adhesive resin ver.01
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